Abstract
Nanofabrication for Energy-Efficient AI: Enabling the Next Frontier in Computing
The relentless demand for faster, smaller, and more energy-efficient electronics—driven by the rise of AI and data-centric applications—continues to push the boundaries of semiconductor technology. This talk provides a high-level overview of nanofabrication in the semiconductor industry, highlighting its critical role in enabling device scaling and performance improvements. Key process technologies will be discussed, along with emerging trends like gate-all-around (GAA), CFET, 3D DRAM, and backside power delivery. The presentation will also touch on innovations in materials engineering for future electronics, and the growing importance of heterogeneous integration and advanced packaging. Finally, the role of Applied Materials in driving process, equipment, and materials solutions across the entire semiconductor industry will be outlined.
Biography
Xiangyu (Sean) Liu is a senior process integration engineer at Applied Materials, where his current role focuses on advanced logic Integration and process development. He previously worked at Micron Technology, focusing on 3D NAND process integration. He has contributed to the development of cutting-edge scalable fabrication solutions for both logic and memory sectors, supporting the industry's drive toward energy-efficient AI and next-generation computing. He holds a Ph.D. in Materials Chemistry from New York University, where his research focused on advanced thermal scanning probe lithography for nanoelectronics and nanomedicine.